Ultra-fine Solder Paste Dispensing for Heterogeneous Integration
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  • Create Date June 16, 2020
  • Last Updated June 19, 2020

Ultra-fine Solder Paste Dispensing for Heterogeneous Integration

Ultra-fine solder paste dispensing is only achievable with the correct combination of dispensing equipment and solder materials. The objective of this study is to explore and demonstrate a solution for achieving consistent fine dot dispensing.

This paper will discuss different dispensing equipment technologies and also important solder paste characteristics, and results will be presented in a statistical method like Cpk, standard deviations, etc.

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