October 28, 2022

NSW N4 Launching Event 2022

The N4 Full Range Solder Paste Micro-dispenser was officially unveiled on October 18th, 2022 at the Setia SPICE Convention Centre (Penang). We want to thank everyone for attending.

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Stencil Screen Printing vs dispensing
June 17, 2021

Stencil Printing vs Dispensing

This article discusses the differences between stencil printing and fluid dispensing for electronic component manufacturing. Advantages and disadvantages ..etc

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December 10, 2020

SD1 Series Product Launching Day

Hooray! on Q4 2020, We launched our new 2020 automated Intelligent Clog-FREE Micro-dispenser, The SD1 Series. This Launching event includes the introduction of two new machine models: The SD1 and SD1-X.

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Jetting VS Contact Dispensing Header
July 15, 2020

Contact Dispensing and Non-Contact Jetting

Understand Contact Dispensing and Non-Contact Jetting. Why most SMD professionals prefer contact dispensing over fluid jetting for precise micro dispensing applications such as wafer-level packaging, 008004 solderings, PoP, SiP, 3D-mid jobs?

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